Product Features
1.Adopting high-performance ultraviolet technology/Green laser, with good laser beam quality, high peak power, narrow pulse width, and high pulse stability;
2.Focusing on small spot size, narrow incision, smooth cutting edge, small edge breakage, fast processing speed, ensuring processing quality and stability;
3.Equipped with high-precision scanning mirrors, fast speed and high precision;
4.Equipped with industrial specific control equipment, the entire process is automatically controlled by computer software and can run for a long time;
5.Non contact laser processing method produces no stress on the processed material and can process irregular and micro holes.
Application industry
Suitable for micro hole drilling and fine cutting of mobile phone covers, optical glass, sapphire substrates, and electrical glass materials. Micro hole and irregular hole processing and shape cutting in the watch industry.
Technical Parameter
UVlaser device |
Green Laser |
|
wavelength |
355nm |
532nm |
rated power |
10-20W |
10/20W |
Positioning accuracy of linear motor worktable |
±2μm |
|
Repetitive accuracy of linear motor worktable |
±1μm |
|
machine range |
400mmX300mm(Customizable according to customer requirements) |
|
CCDAutomatic positioning accuracy |
±3μm |
|
Single work format |
40х40mm |
110x110mm |
Mirror repeatability accuracy |
±1μm |
|
Cutting size accuracy |
<30μm |
|
Cutting position accuracy |
<50μm |
|
Edge collapse quantity |
≤0.1mm |
|
Capable of handling file formats |
Standard Gerber files, DXF files, PLT files, etc |